TE-720 Chip Magnetic Suction Pad Silicone Mat 0.3/0.4/0.7/0.8MM CPU IC Glue Remover & Tin Planting Pad

Description TE-720 Chip Magnetic Suction Pad Silicone Mat 0.3/0.4/0.7/0.8MM CPU IC Glue Remover & Tin Planting Pad Product Features :- High-Quality Silicone Material ? Heat-resistant, non-slip, and durable for repeated use. Magnetic Suction Design ? Holds small components and tools firmly in place during repair. Multiple Thickness Options ? Available in 0.3mm, 0.4mm, 0.7mm, and 0.8mm for different repair needs. Ideal for IC & CPU Work ? Perfect for glue removal, chip repair, and tin planting. Anti-Static Surface ? Protects sensitive electronic components from static damage. Easy to Clean & Reusable ? Silicone surface resists glue and solder residue. Compact & Portable ? Lightweight design fits easily on any repair workstation.